S136H · 1+1 cavities
An edge gate and direct ejection were matched to the approved PC part and insert arrangement.
A second PC enclosure program for semiconductor charging equipment. The thin product and multiple insert moulded nuts required careful draft, local reinforcement and repeatable filling through trial correction.

The customer required a 30 day mould delivery for a PC semiconductor charging station enclosure. The design combined thin sections with several insert moulded nuts, so the main review topics were filling, draft, local wall thickness and insert stability.
An edge gate and direct ejection were matched to the approved PC part and insert arrangement.
CNC, slow wire EDM, mirror EDM, grinding and milling supported the mould build and detail finishing.
Short shots, nut marks and multiple insert issues were addressed by increasing draft and thickening the nut areas.
The mould was delivered within 30 days. Three trial rounds resolved the filling and insert related issues, reaching a final good part rate of 96%. The parts were accepted for assembly and the finished product moved into the market.
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